<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5223.311mil|Location2.X=5231.22mil|Location1.Y=2128.552mil|Location2.Y=2136.727mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5223.311mil|Location2.X=5231.22mil|Location1.Y=2128.552mil|Location2.Y=2136.727mil|Absolute=True">Clearance Constraint: (5.045mil < 6mil) Between Pad P1-(3535.663mil,644.54mil) on Multi-Layer And Pad P1-A1(3493.537mil,627.436mil) on Top Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5222.847mil|Location2.X=5230.097mil|Location1.Y=2146.93mil|Location2.Y=2154.18mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5222.847mil|Location2.X=5230.097mil|Location1.Y=2146.93mil|Location2.Y=2154.18mil|Absolute=True">Clearance Constraint: (3.685mil < 6mil) Between Pad P1-(3535.663mil,644.54mil) on Multi-Layer And Pad P1-A4(3493.537mil,658.855mil) on Top Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5222.095mil|Location2.X=5229.345mil|Location1.Y=2138.032mil|Location2.Y=2145.282mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5222.095mil|Location2.X=5229.345mil|Location1.Y=2138.032mil|Location2.Y=2145.282mil|Absolute=True">Clearance Constraint: (1.824mil < 6mil) Between Pad P1-(3535.663mil,644.54mil) on Multi-Layer And Pad P1-B12(3493.537mil,637.278mil) on Top Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5223.312mil|Location2.X=5231.137mil|Location1.Y=2376.719mil|Location2.Y=2384.949mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5223.312mil|Location2.X=5231.137mil|Location1.Y=2376.719mil|Location2.Y=2384.949mil|Absolute=True">Clearance Constraint: (5.047mil < 6mil) Between Pad P1-(3535.663mil,872.099mil) on Multi-Layer And Pad P1-A12(3493.537mil,889.206mil) on Top Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5222.862mil|Location2.X=5230.112mil|Location1.Y=2359.189mil|Location2.Y=2366.439mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5222.862mil|Location2.X=5230.112mil|Location1.Y=2359.189mil|Location2.Y=2366.439mil|Absolute=True">Clearance Constraint: (3.725mil < 6mil) Between Pad P1-(3535.663mil,872.099mil) on Multi-Layer And Pad P1-A9(3493.537mil,857.692mil) on Top Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5222.095mil|Location2.X=5229.345mil|Location1.Y=2368.166mil|Location2.Y=2375.416mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5222.095mil|Location2.X=5229.345mil|Location1.Y=2368.166mil|Location2.Y=2375.416mil|Absolute=True">Clearance Constraint: (1.824mil < 6mil) Between Pad P1-(3535.663mil,872.099mil) on Multi-Layer And Pad P1-B1(3493.537mil,879.364mil) on Top Layer </acronym></a><br></td>
</tr>
</table></a><hrcolor="#EEEEEE"><ahref="#top"style="font-size: 0.9em">Back to top</a><br><br><aname="IDAUWVTQOYZX25C5XU0PVI5OMLNBVUBKFMSSB4TWF4QFMXQGZQZWGC"><table>
<tr>
<thstyle="text-align : left"colspan="1"class="rule">Hole To Hole Clearance (Gap=10mil) (All),(All)</th>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5359.205mil|Location2.X=5366.872mil|Location1.Y=2093.755mil|Location2.Y=2101.421mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5359.205mil|Location2.X=5366.872mil|Location1.Y=2093.755mil|Location2.Y=2101.421mil|Absolute=True">Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad P1-MH(3681.332mil,588.044mil) on Multi-Layer And Via (3656.37mil,599.185mil) from Top Layer to Bottom Layer Pad/Via Touching Holes</acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5359.205mil|Location2.X=5366.872mil|Location1.Y=2426.612mil|Location2.Y=2434.278mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5359.205mil|Location2.X=5366.872mil|Location1.Y=2426.612mil|Location2.Y=2434.278mil|Absolute=True">Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad P1-MH(3681.332mil,928.597mil) on Multi-Layer And Via (3656.37mil,932.042mil) from Top Layer to Bottom Layer Pad/Via Touching Holes</acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3104.422mil|Location2.X=3115.672mil|Location1.Y=2447.418mil|Location2.Y=2458.668mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3104.422mil|Location2.X=3115.672mil|Location1.Y=2447.418mil|Location2.Y=2458.668mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH1-1(1457.25mil,954.899mil) on Multi-Layer And Via (1392.815mil,954.589mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3120.017mil|Location2.X=3131.267mil|Location1.Y=2485.586mil|Location2.Y=2496.836mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3120.017mil|Location2.X=3131.267mil|Location1.Y=2485.586mil|Location2.Y=2496.836mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH1-1(1457.25mil,954.899mil) on Multi-Layer And Via (1411.468mil,1000.242mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3120.384mil|Location2.X=3131.634mil|Location1.Y=2409.401mil|Location2.Y=2420.651mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3120.384mil|Location2.X=3131.634mil|Location1.Y=2409.401mil|Location2.Y=2420.651mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH1-1(1457.25mil,954.899mil) on Multi-Layer And Via (1411.907mil,909.117mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3158.033mil|Location2.X=3169.283mil|Location1.Y=2501.548mil|Location2.Y=2512.798mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3158.033mil|Location2.X=3169.283mil|Location1.Y=2501.548mil|Location2.Y=2512.798mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH1-1(1457.25mil,954.899mil) on Multi-Layer And Via (1456.94mil,1019.335mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3158.552mil|Location2.X=3169.802mil|Location1.Y=2393.806mil|Location2.Y=2405.056mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3158.552mil|Location2.X=3169.802mil|Location1.Y=2393.806mil|Location2.Y=2405.056mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH1-1(1457.25mil,954.899mil) on Multi-Layer And Via (1457.561mil,890.464mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3196.569mil|Location2.X=3207.819mil|Location1.Y=2409.768mil|Location2.Y=2421.018mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3196.569mil|Location2.X=3207.819mil|Location1.Y=2409.768mil|Location2.Y=2421.018mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH1-1(1457.25mil,954.899mil) on Multi-Layer And Via (1503.032mil,909.556mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3212.272mil|Location2.X=3223.522mil|Location1.Y=2451.824mil|Location2.Y=2463.074mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3212.272mil|Location2.X=3223.522mil|Location1.Y=2451.824mil|Location2.Y=2463.074mil|Absolute=True">Hole To Hole Clearance Constraint: (9.85mil < 10mil) Between Pad PTH1-1(1457.25mil,954.899mil) on Multi-Layer And Via (1522.028mil,959.875mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=1923.542mil|Location2.X=1934.792mil|Location1.Y=2447.418mil|Location2.Y=2458.668mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=1923.542mil|Location2.X=1934.792mil|Location1.Y=2447.418mil|Location2.Y=2458.668mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH2-1(276.37mil,954.899mil) on Multi-Layer And Via (211.935mil,954.589mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=1939.137mil|Location2.X=1950.387mil|Location1.Y=2485.586mil|Location2.Y=2496.836mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=1939.137mil|Location2.X=1950.387mil|Location1.Y=2485.586mil|Location2.Y=2496.836mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH2-1(276.37mil,954.899mil) on Multi-Layer And Via (230.588mil,1000.242mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=1939.504mil|Location2.X=1950.754mil|Location1.Y=2409.401mil|Location2.Y=2420.651mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=1939.504mil|Location2.X=1950.754mil|Location1.Y=2409.401mil|Location2.Y=2420.651mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH2-1(276.37mil,954.899mil) on Multi-Layer And Via (231.027mil,909.117mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=1977.154mil|Location2.X=1988.404mil|Location1.Y=2501.548mil|Location2.Y=2512.798mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=1977.154mil|Location2.X=1988.404mil|Location1.Y=2501.548mil|Location2.Y=2512.798mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH2-1(276.37mil,954.899mil) on Multi-Layer And Via (276.06mil,1019.335mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=1977.673mil|Location2.X=1988.923mil|Location1.Y=2393.806mil|Location2.Y=2405.056mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=1977.673mil|Location2.X=1988.923mil|Location1.Y=2393.806mil|Location2.Y=2405.056mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH2-1(276.37mil,954.899mil) on Multi-Layer And Via (276.681mil,890.464mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=2015.689mil|Location2.X=2026.939mil|Location1.Y=2409.768mil|Location2.Y=2421.018mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=2015.689mil|Location2.X=2026.939mil|Location1.Y=2409.768mil|Location2.Y=2421.018mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH2-1(276.37mil,954.899mil) on Multi-Layer And Via (322.153mil,909.556mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=2031.392mil|Location2.X=2042.642mil|Location1.Y=2451.824mil|Location2.Y=2463.074mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=2031.392mil|Location2.X=2042.642mil|Location1.Y=2451.824mil|Location2.Y=2463.074mil|Absolute=True">Hole To Hole Clearance Constraint: (9.85mil < 10mil) Between Pad PTH2-1(276.37mil,954.899mil) on Multi-Layer And Via (341.148mil,959.875mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3104.422mil|Location2.X=3115.672mil|Location1.Y=1726.953mil|Location2.Y=1738.203mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3104.422mil|Location2.X=3115.672mil|Location1.Y=1726.953mil|Location2.Y=1738.203mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH3-1(1457.25mil,234.435mil) on Multi-Layer And Via (1392.815mil,234.124mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3120.017mil|Location2.X=3131.267mil|Location1.Y=1765.122mil|Location2.Y=1776.372mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3120.017mil|Location2.X=3131.267mil|Location1.Y=1765.122mil|Location2.Y=1776.372mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH3-1(1457.25mil,234.435mil) on Multi-Layer And Via (1411.468mil,279.778mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3120.384mil|Location2.X=3131.634mil|Location1.Y=1688.937mil|Location2.Y=1700.187mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3120.384mil|Location2.X=3131.634mil|Location1.Y=1688.937mil|Location2.Y=1700.187mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH3-1(1457.25mil,234.435mil) on Multi-Layer And Via (1411.907mil,188.653mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3158.033mil|Location2.X=3169.283mil|Location1.Y=1781.084mil|Location2.Y=1792.334mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3158.033mil|Location2.X=3169.283mil|Location1.Y=1781.084mil|Location2.Y=1792.334mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH3-1(1457.25mil,234.435mil) on Multi-Layer And Via (1456.94mil,298.87mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3158.552mil|Location2.X=3169.802mil|Location1.Y=1673.342mil|Location2.Y=1684.592mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3158.552mil|Location2.X=3169.802mil|Location1.Y=1673.342mil|Location2.Y=1684.592mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH3-1(1457.25mil,234.435mil) on Multi-Layer And Via (1457.561mil,170mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3196.569mil|Location2.X=3207.819mil|Location1.Y=1689.304mil|Location2.Y=1700.554mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3196.569mil|Location2.X=3207.819mil|Location1.Y=1689.304mil|Location2.Y=1700.554mil|Absolute=True">Hole To Hole Clearance Constraint: (9.318mil < 10mil) Between Pad PTH3-1(1457.25mil,234.435mil) on Multi-Layer And Via (1503.032mil,189.092mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3212.272mil|Location2.X=3223.522mil|Location1.Y=1731.359mil|Location2.Y=1742.609mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=3212.272mil|Location2.X=3223.522mil|Location1.Y=1731.359mil|Location2.Y=1742.609mil|Absolute=True">Hole To Hole Clearance Constraint: (9.85mil < 10mil) Between Pad PTH3-1(1457.25mil,234.435mil) on Multi-Layer And Via (1522.028mil,239.411mil) from Top Layer to Bottom Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=2133.821mil|Location2.X=2145.071mil|Location1.Y=3662.105mil|Location2.Y=3673.355mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=2133.821mil|Location2.X=2145.071mil|Location1.Y=3662.105mil|Location2.Y=3673.355mil|Absolute=True">Hole To Hole Clearance Constraint: (8.702mil < 10mil) Between Pad PTH4-1(388.714mil,2118.401mil) on Multi-Layer And Pad PTH4-1(440.777mil,2178.571mil) on Multi-Layer </acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=4830.672mil|Location2.X=4841.922mil|Location1.Y=2579.427mil|Location2.Y=2590.677mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=4830.672mil|Location2.X=4841.922mil|Location1.Y=2579.427mil|Location2.Y=2590.677mil|Absolute=True">Hole To Hole Clearance Constraint: (8.702mil < 10mil) Between Pad PTH5-1(3085.565mil,1035.723mil) on Multi-Layer And Pad PTH5-1(3137.628mil,1095.894mil) on Multi-Layer </acronym></a><br></td>
</tr>
</table></a><hrcolor="#EEEEEE"><ahref="#top"style="font-size: 0.9em">Back to top</a><br><br><aname="IDJWLQZOVAROWHMM213K0VCCORRFH5RDGRA3LE24ORDYXIHEHQKY5B"><table>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5227.686mil|Location2.X=5229.936mil|Location1.Y=2334.812mil|Location2.Y=2337.062mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5227.686mil|Location2.X=5229.936mil|Location1.Y=2334.812mil|Location2.Y=2337.062mil|Absolute=True">Minimum Solder Mask Sliver Constraint: (0.823mil < 1mil) Between Pad P1-B4(3493.537mil,847.851mil) on Top Layer And Pad P1-B5(3493.537mil,827.217mil) on Top Layer [Top Solder] Mask Sliver [0.823mil]</acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5227.686mil|Location2.X=5229.936mil|Location1.Y=2176.337mil|Location2.Y=2178.587mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5227.686mil|Location2.X=5229.936mil|Location1.Y=2176.337mil|Location2.Y=2178.587mil|Absolute=True">Minimum Solder Mask Sliver Constraint: (0.914mil < 1mil) Between Pad P1-B8(3493.537mil,689.422mil) on Top Layer And Pad P1-B9(3493.537mil,668.697mil) on Top Layer [Top Solder] Mask Sliver [0.914mil]</acronym></a><br></td>
</tr>
</table></a><hrcolor="#EEEEEE"><ahref="#top"style="font-size: 0.9em">Back to top</a><br><br><aname="IDYA0WLW3B5XCOEIPDFKRON122RJHB530AJ4U03GEBXSOSVMKK2JBJ"><table>
<tr>
<thstyle="text-align : left"colspan="1"class="rule">Silk To Solder Mask (Clearance=1mil) (IsPad),(All)</th>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5258.426mil|Location2.X=5260.093mil|Location1.Y=2079.905mil|Location2.Y=2081.571mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5258.426mil|Location2.X=5260.093mil|Location1.Y=2079.905mil|Location2.Y=2081.571mil|Absolute=True">Silk To Solder Mask Clearance Constraint: (Collision < 1mil) Between Pad P1-MH(3516.765mil,588.044mil) on Multi-Layer And Track (3552.592mil,582.335mil)(3629.364mil,582.335mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]</acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5258.426mil|Location2.X=5260.093mil|Location1.Y=2431.873mil|Location2.Y=2433.54mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=5258.426mil|Location2.X=5260.093mil|Location1.Y=2431.873mil|Location2.Y=2433.54mil|Absolute=True">Silk To Solder Mask Clearance Constraint: (Collision < 1mil) Between Pad P1-MH(3516.829mil,928.597mil) on Multi-Layer And Track (3552.592mil,934.303mil)(3629.364mil,934.303mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]</acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=1903.604mil|Location2.X=1905.271mil|Location1.Y=2432.674mil|Location2.Y=2434.341mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=1903.604mil|Location2.X=1905.271mil|Location1.Y=2432.674mil|Location2.Y=2434.341mil|Absolute=True">Silk To Solder Mask Clearance Constraint: (Collision < 1mil) Between Pad PTH2-1(276.37mil,954.899mil) on Multi-Layer And Track (197.77mil,36.951mil)(197.77mil,1100.378mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mil]</acronym></a><br></td>
<tdclass="column1"><ahref="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=2019.167mil|Location2.X=2020.833mil|Location1.Y=2377.041mil|Location2.Y=2378.708mil|Absolute=True"class="callback"><acronymtitle="dxpprocess://PCB:Zoom?document=E:\01_pcb\ideas\SR\SR011\SR011_A01\V1.0\pcb\SR011_A01_V1.0.PcbDoc;viewname=PCBEditor;Action=AREA_DYNAMICZOOM|Location1.X=2019.167mil|Location2.X=2020.833mil|Location1.Y=2377.041mil|Location2.Y=2378.708mil|Absolute=True">Silk To Solder Mask Clearance Constraint: (Collision < 1mil) Between Pad PTH2-1(276.37mil,954.899mil) on Multi-Layer And Track (313.332mil,842.542mil)(313.332mil,1210.652mil) on Bottom Overlay [Bottom Overlay] to [Bottom Solder] clearance [0mil]</acronym></a><br></td>
</tr>
</table></a><hrcolor="#EEEEEE"><ahref="#top"style="font-size: 0.9em">Back to top</a><br><br></body>